6-Layer Hybrid PCB with RO4350B and High Tg FR-4 for RF Applications
1.Product Introduction: Advanced Hybrid PCB Technology
This innovative 6-layer hybrid PCB combines Rogers RO4350B high-frequency material with standard High Tg FR-4 (Tg170°C) in an optimized stackup, delivering superior RF performance while maintaining cost efficiency. The hybrid construction strategically places RO4350B (Dk=3.48±0.05) in critical signal layers for optimal high-frequency response, while utilizing cost-effective FR-4 for structural support and power distribution. This approach provides the perfect balance between RF performance, thermal reliability, and manufacturing economics for modern wireless systems.
2.Key Material Properties
RO4350B Characteristics
Dielectric Constant: 3.48±0.05 @10GHz
Ultra-Low Loss: 0.0037 dissipation factor @10GHz
Thermal Stability: 32 ppm/°C Z-axis CTE
Process Compatibility: Standard FR-4 fabricationB<
Flame Rating: UL 94 V-0 certified
High Tg FR-4 Features
High Temp Resistance: Tg≥170°C
Mechanical Strength: Excellent multilayer compatibility
Cost Efficiency: Traditional epoxy/fiberglass benefits
Lead-Free Compatible: Withstands high-temp soldering
3.PCB Construction Specifications
| Parameter | Specification |
|---|---|
| Base Material | RO4350B / Tg170 FR-4 |
| Layer Count | 6-Layer |
| Board Dimensions | 155mm × 120mm (±0.15mm) |
| Minimum Trace/Space | 4/6 mils |
| Minimum Hole Size | 0.4mm |
| Via Type | Through-Hole Only |
| Finished Thickness | 1.6mm |
| Copper Weight | 1oz (35μm) outer layers |
| Via Plating Thickness | 20μm |
| Surface Finish | Immersion Silver |
| Top Silkscreen | White |
| Bottom Silkscreen | None |
| Top Solder Mask | Green |
| Bottom Solder Mask | Green |
| Electrical Testing | 100% tested prior to shipme |
4.PCB Stackup:
Copper layer 1 - 35 μm
RO4350B - 0.422 mm (16.6mil)
Copper layer 2 - 35 μm
Prepreg - 0.102mm
Copper layer 3 - 35 μm
Tg170°C FR-4 - 0.254mm
Copper layer 4 - 35 μm
PrePreg - 0.002mm
Copper layer 5 - 35 μm
Tg170°C FR-4 - 0.508mm
Copper layer 6 - 35 μm
5.Board Statistics
Components: 77
Total Pads: 276
Thru Hole Pads: 178
Top SMT Pads: 86
Bottom SMT Pads: 12
Vias: 213
Nets: 11
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Performance Optimization: RO4350B for critical RF paths, FR-4 for power/cost
Thermal Reliability: Withstands lead-free reflow processes
Impedance Control: ±0.05 Dk tolerance in RF sections
Manufacturing Efficiency: Standard FR-4 processes throughout
8.Target Applications
Cellular Base Station Antennas and Power Amplifiers
- RF Identification Tags
- Automotive Radar and Sensors
- LNB’s for Direct Broadcast Satellites